According to a new report, Huawei and HiSilicon are expected to deliver some major chip news next month. This is expected to happen during HiSilicon’s Connect Conference. This conference is taking place in Shenzen on September 9 and 10.
Huawei & HiSilicon could deliver major chip news next month
So, what can we expect? Well, based on a report from SCMP, this event has “triggered talk of breakthroughs and the official formation of a Huawei-centred ecosystem from chip design to operating systems”.
Additionally, Shenzen Huaqiang, a distributor of HiSilicon’s products, had something interesting to say. In a statement sent out on Monday, investors were warned that there are still “uncertainties” around HiSilicon’s new product launch at the conference.
Either way, we should get some insight in regards to HiSilicon chips next month, at the very least. HiSilicon is a big part of Huawei’s plans following a bevy of sanctions from the US.
Kirin chips made it possible for Huawei to offer 5G on its smartphones
Thanks to HiSilicon’s Kirin chips that Huawei has been using in its newest products, the company is not only able to go around some sanctions, but it’s also able to offer 5G on its products again. Well, that is mostly true for its home market, as 5G availability is not guaranteed globally.
The upcoming Huawei Mate series, the Mate 70 series, is expected to utilize a new Kirin chip. Huawei and HiSilicon are expected to announce a 5nm processor, following a couple of 7nm ones they announced.
Having a 5nm chip will be a step in the right direction. 3nm chips have been on the market for quite some time now, though. The company’s tri-fold device that is coming next month is also expected to utilize that new Kirin chip.
All in all, Huawei is expected to have quite a few announcements to share with us in the remainder of the year.
The post Huawei & HiSilicon expected to deliver major chip news next month appeared first on Android Headlines.